基于热反射的半导体器件热成像相机

Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (IEEE Cat. No.04CH37545) Pub Date : 2004-03-09 DOI:10.1109/STHERM.2004.1291306

J. Christofferson, A. Shakouri

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引用次数: 5

摘要

研制了一种适用于微米级有源半导体器件的热成像仪。基于可见光热反射技术，该相机在对顶部金属接触层成像时达到50mK的温度灵敏度和亚微米的空间分辨率。通过使用光电二极管阵列，灵敏度比基于CCD(电荷耦合器件)的系统有所提高。给出了直径为10微米的超小型SiGe微冷却器的热成像结果。

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Camera for thermal imaging of semiconductor devices based on thermoreflectance

A thermal imaging camera suitable for use on micron-sized active semiconductor devices has been developed. Based on a visible light thermoreflectance technique, this camera achieves 50mK temperature sensitivity and sub-micron spatial resolution when imaging the top metal contact layer. By using a photodiode array, sensitivity is improved over what is possible with a CCD (Charge Coupled Device) based system. Thermal imaging results of an ultra small 10 micron diameter SiGe micro-cooler is also presented.

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Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (IEEE Cat. No.04CH37545)

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