类spice环境中损耗和色散互连的频域和时域随机分析

Paolo Manfredi, D. Ginste, D. Zutter, F. Canavero
{"title":"类spice环境中损耗和色散互连的频域和时域随机分析","authors":"Paolo Manfredi, D. Ginste, D. Zutter, F. Canavero","doi":"10.1109/EPEPS.2012.6457844","DOIUrl":null,"url":null,"abstract":"This paper presents an improvement of the state-of-the-art polynomial chaos (PC) modeling of high-speed interconnects with parameter uncertainties via SPICE-like tools. While the previous model, due to its mathematical formulation, was limited to lossless lines, the introduction of modified classes of polynomials yields a formulation that allows to account for lossess and dispersion as well. Thanks to this, the new implementation can also take full advantage of the combination of the PC technique with macromodels that accurately describe the interconnect properties. An application example, i.e. the stochastic analysis of an on-chip line, validates and demonstrates the improved method.","PeriodicalId":188377,"journal":{"name":"2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems","volume":"6 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Frequency- and time-domain stochastic analysis of lossy and dispersive interconnects in a SPICE-like environment\",\"authors\":\"Paolo Manfredi, D. Ginste, D. Zutter, F. Canavero\",\"doi\":\"10.1109/EPEPS.2012.6457844\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents an improvement of the state-of-the-art polynomial chaos (PC) modeling of high-speed interconnects with parameter uncertainties via SPICE-like tools. While the previous model, due to its mathematical formulation, was limited to lossless lines, the introduction of modified classes of polynomials yields a formulation that allows to account for lossess and dispersion as well. Thanks to this, the new implementation can also take full advantage of the combination of the PC technique with macromodels that accurately describe the interconnect properties. An application example, i.e. the stochastic analysis of an on-chip line, validates and demonstrates the improved method.\",\"PeriodicalId\":188377,\"journal\":{\"name\":\"2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems\",\"volume\":\"6 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2012-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEPS.2012.6457844\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEPS.2012.6457844","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

摘要

本文利用SPICE-like工具,对具有参数不确定性的高速互连的最先进的多项式混沌(PC)建模进行了改进。而之前的模型,由于其数学公式,仅限于无损线,改进的多项式类的引入产生了一个公式,允许考虑损失和分散。因此,新的实现还可以充分利用PC技术与精确描述互连特性的宏模型的结合。一个应用实例,即片上线的随机分析,验证和证明了改进的方法。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Frequency- and time-domain stochastic analysis of lossy and dispersive interconnects in a SPICE-like environment
This paper presents an improvement of the state-of-the-art polynomial chaos (PC) modeling of high-speed interconnects with parameter uncertainties via SPICE-like tools. While the previous model, due to its mathematical formulation, was limited to lossless lines, the introduction of modified classes of polynomials yields a formulation that allows to account for lossess and dispersion as well. Thanks to this, the new implementation can also take full advantage of the combination of the PC technique with macromodels that accurately describe the interconnect properties. An application example, i.e. the stochastic analysis of an on-chip line, validates and demonstrates the improved method.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信