在封装和半导体器件中恢复接触界面:机制和如何在分析中处理它们

2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Pub Date : 2016-07-18 DOI:10.1109/IPFA.2016.7564310

P. Jacob, C. Pecnik, G. Nicoletti, R. Broennimann

{"title":"在封装和半导体器件中恢复接触界面:机制和如何在分析中处理它们","authors":"P. Jacob, C. Pecnik, G. Nicoletti, R. Broennimann","doi":"10.1109/IPFA.2016.7564310","DOIUrl":null,"url":null,"abstract":"Several analysis cases reported contact problems on both device and packaged level. However, they recovered upon the attempt to electrically verify them. Further analysis showed that this recovery can be achieved through extremely low ESD effects. Recovery mechanisms and important precautions will be further discussed in order to avoid sudden disappearance of recoverable opens.","PeriodicalId":206237,"journal":{"name":"2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","volume":"18 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-07-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Recovering contacting interfaces in packaging and in semiconductor devices: Mechanisms and how to handle them in analysis\",\"authors\":\"P. Jacob, C. Pecnik, G. Nicoletti, R. Broennimann\",\"doi\":\"10.1109/IPFA.2016.7564310\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Several analysis cases reported contact problems on both device and packaged level. However, they recovered upon the attempt to electrically verify them. Further analysis showed that this recovery can be achieved through extremely low ESD effects. Recovery mechanisms and important precautions will be further discussed in order to avoid sudden disappearance of recoverable opens.\",\"PeriodicalId\":206237,\"journal\":{\"name\":\"2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"volume\":\"18 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-07-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IPFA.2016.7564310\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2016.7564310","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 0

摘要

几个分析案例报告了器件级和封装级的接触问题。然而，在试图用电验证它们时，它们恢复了。进一步分析表明，这种采收率可以通过极低的ESD效应来实现。为了避免可恢复开口突然消失，将进一步讨论恢复机制和重要注意事项。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Recovering contacting interfaces in packaging and in semiconductor devices: Mechanisms and how to handle them in analysis

Several analysis cases reported contact problems on both device and packaged level. However, they recovered upon the attempt to electrically verify them. Further analysis showed that this recovery can be achieved through extremely low ESD effects. Recovery mechanisms and important precautions will be further discussed in order to avoid sudden disappearance of recoverable opens.

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2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

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