残金属去除是DFM的一个元素

Proceedings 1998 IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems (Cat. No.98EX223) Pub Date : 1998-11-02 DOI:10.1109/DFTVS.1998.732149

Neil Harrison

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引用次数: 1

摘要

通过修改金属轨迹来提高设计的成品率和可制造性的讨论显然忽略了一个潜在的重要的第一步——去除设计中多余的金属。描述了使用Cadence布局系统中存在的工具识别和去除多余或“孤儿”金属的技术。概述了该技术在0.8微米模拟BiCMOS工艺设计的半定制产品中的应用。

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Orphan metal removal as an element of DFM

Discussion of improving the yield and manufacturability of designs through the modification of metal tracks has apparently neglected a potentially important first step-that of removal of metal which is surplus to the design. A technique is described for the identification and removal of surplus or 'orphan' metal using tools present in the Cadence layout system. Application of this technique to a semi-custom product designed in a 0.8 micron analog BiCMOS process is outlined.

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Proceedings 1998 IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems (Cat. No.98EX223)

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