为什么ASIC代工厂会接受不完全扫描的东西?

S. F. Oakland
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引用次数: 2

摘要

IBM在专用集成电路(ASIC)市场的增长背后的一个关键力量是能够在不需要测试向量的情况下签署数百万栅极设计,从而为客户节省时间和金钱。一旦客户确保(通过正式验证和/或功能模拟)设计按要求运行,静态着色分析(STA)就可以确保设计达到所需的性能目标。广泛的模型到硬件的相关性确保了时序分析模型的正确性,使IBM能够确保设计能够达到所需的性能目标。通过全扫描和边界扫描测试设计(DFT)结构的结合,IBM ASIC方法确保自动生成的测试模式将在测试设备上正确运行;通常达到99%以上的卡故障覆盖率。在可重复的制造缺陷的情况下,基于全面扫描的诊断软件在没有客户参与的情况下隔离了问题。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Why would an ASIC foundry accept anything less than full scan?
A key force behind IBM's growth in the application-specific integrated circuit (ASIC) market is the ability to sign off on multi-million-gate designs without requiring test vectors, presenting a savings in both time and money to customers. Once a customer ensures (via formal verification and/or functional simulation) that the design functions as required, static tinting analysis (STA) ensures that the design achieves the required performance targets. Extensive model-to-hardware correlation assures correctness of the timing analysis models, enabling IBM to assure that the design can be manufactured to the required performance targets. Through a combination of full-scan and boundary-scan design-for-test (DFT) structures, the IBM ASIC methodology ensures that automatically generated test patterns will run correctly on test equipment; typically achieving 99+% stuck-fault coverage. In the case of a repeatable manufacturing defect, full-scan-based diagnostic software isolates the problem without customer involvement.
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