混沌神经网络库在TSV/$\mu\text{Bump}$堆叠三维循环神经网络集成电路上的实现

Y. Horio, Takemori Orima, K. Kiyoyama, M. Koyanagi
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引用次数: 0

摘要

提出了一种TSV/$\mu\text{Bump}$堆叠的三维循环深度神经网络集成电路结构。此外,还设计了一种将混沌神经网络库嵌入到所提出的体系结构中的技术。设计和制造了一个概念验证神经网络芯片和一个权重存储芯片,以验证所提出架构的可行性。在本研究中,通过测量电路模块来评估配置为循环混沌神经元电路的神经元芯片,并根据芯片的测量结果构建专用的MATLAB电路仿真器。给出了MATLAB仿真器的一些结果。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Implementation of a Chaotic Neural Network Reservoir on a TSV/$\mu\text{Bump}$ Stacked 3D Cyclic Neural Network Integrated Circuit
A TSV/$\mu\text{Bump}$ stacked 3D cyclic deep neural network integrated circuit architecture was proposed. Furthermore, a technique for embedding a chaotic neural network reservoir into the proposed architecture was devised. A proof-of-concept neural network chip, and a weight memory chip have been designed and fabricated to confirm the feasibly of the proposed architecture. In this study, the neuron chip configured as a cyclic chaotic neuron circuit is evaluated by measuring circuit building blocks, and constructing a dedicated MATLAB circuit emulator based on the measurement results from the chip. Some of the results from the MATLAB emulator are illustrated.
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