2021 IEEE International 3D Systems Integration Conference (3DIC)

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2021 IEEE International 3D Systems Integration Conference (3DIC) - 最新文献

Cu-Cu Direct Bonding Through Highly Oriented Cu Grains for 3D-LSI Applications

Pub Date : 2021-10-01 DOI: 10.1109/3dic52383.2021.9687604 M. Murugesan, E. Sone, A. Simomura, M. Motoyoshi, M. Sawa, K. Fukuda, M. Koyanagi, T. Fukushima

Proposed Standardization of Heterogenous Integrated Chiplet Models

Pub Date : 2021-10-01 DOI: 10.1109/3dic52383.2021.9687611 Anthony Mastroianni, Benjamin Kerr, J. Nasrullah, Kevin Cameron, Hockshan James Wong, David Ratchkov, J. Reynick

Electrical and Performance Benefits of Advanced Monolithic Cooling for 2.5D Heterogeneous ICs

Pub Date : 2021-10-01 DOI: 10.1109/3dic52383.2021.9687618 Sreejith Kochupurackal Rajan, Ankit Kaul, G. May, M. Bakir

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