异构集成——一项关键的使能技术

R. Aschenbrenner
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引用次数: 2

摘要

先进的硅技术提供了将数亿个晶体管集成到单个电子元件(如微处理器)中的可能性。专家预测,在未来十年,每个芯片的组件数量的增长也将遵循众所周知的“摩尔定律”。“微电子学”将变成“纳米电子学”。这种趋势可以用“更多摩尔”来描述。如果电子信号和数据处理系统是重点,纳米电子元件将非常具有成本效益,因为更大的晶圆尺寸和高度的小型化(片上系统)。但未来的多功能系统不仅需要更多的信号和数据处理能力,还需要与人类感觉器官的接口,以及与环境交互的整体功能。除此之外,还需要天线、光信号和数据传输组件以及能量转换和存储功能。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Heterogeneous integration - A key enabling technology
Advanced silicon technologies offer the possibility of integrating hundreds of millions of transistors in a single electronic component such as a microprocessor. Experts predict that the increase of components per chip will follow the well known “Moore's law” in the next decade, too. “Microelectronics” will become “Nanoelectronics”. This trend can be characterized by “More Moore”. If electronic signal and data processing systems are focussed, nanoelectronic components will be very cost efficient due to larger wafer sizes and a high degree of miniaturization (System-on-Chip). But future multifunctional systems require not only more signal and data processing power but also require interfaces to the human sensory organs and altogether functions for an interaction with the environment. Besides these, antennas, components for optical signals and data transmission as well as functions for energy conversion and storage are also needed.
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