具有不同层内温度的三材料组件界面应力的工程模型

Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) Pub Date : 2004-12-08 DOI:10.1109/EPTC.2004.1396665

D. Sujan, M. Murthy, K. N. Seetharamu, A.Y. Hassan

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引用次数: 0

摘要

结合两个温度比参数，建立了考虑层间温度变化的三层薄结合物界面剪切和剥离应力模型。结果提出了在电子封装中常见的芯片，芯片连接和基板。考虑了二维和三维模型，用有限元方法将解析结果与数值模拟结果进行了比较。无论是剪切应力还是剥离应力，三维模拟结果都比二维模型更符合解析解。

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Engineering model for interfacial stresses of a tri-material assembly with different temperatures in the layers

A model is proposed for the shearing and peeling stresses occurring at the interface of three thin bonded objects to account for different temperatures of the layers by incorporating two temperature ratio parameters. The results are presented for die, die attach and substrate as commonly found in electronic packaging. Both 2D and 3D models are considered for comparison of the analytical results with numerical simulation using finite element method. Both for shearing and peeling stress, the 3D simulation results shows better agreement with analytical solution compare to 2D model.

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Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)

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