集成电路自热包括冷却系统性能的测量和建模

Proceedings of the 2015 International Conference on Microelectronic Test Structures Pub Date : 2015-03-23 DOI:10.1109/ICMTS.2015.7106115

T. Nishimura, H. Tanoue, Y. Oodate, H. Mattausch, M. Miura-Mattausch

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引用次数: 0

摘要

对实际集成电路工作条件下的加热和冷却机理进行了实验和理论研究。为此，研究了不同的芯片封装和冷却系统方式。通过对实验和理论研究的比较，得出了同时增强热辐射和空气对流的最佳封装设计方案。

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Measurement and modeling of IC self-heating including cooling system properties

Heating and cooling mechanisms under actual IC-operating conditions are investigated experimentally and theoretically. For the investigation different chip packages and cooling-system approaches are studied. Comparison between experimental and theoretical studies concludes that the optimum possible package design is obtained by enhancing both the heat radiation and the air convection at the same time.

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Proceedings of the 2015 International Conference on Microelectronic Test Structures

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