45nm节点器件掩模检测方法

Sunghyun Oh, Yongkyoo Choi, Daeho Hwang, Goomin Jeong, O. Han
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引用次数: 1

摘要

对新开发的反射光学光掩模检测工具在45nm DRAM器件上的灵敏度进行了评价。为了获得所需的掩模缺陷灵敏度,利用内部仿真工具对掩模缺陷在晶圆片上的可印刷性进行了仿真。仿真结果与检测结果进行了比较。根据检测工具的探测器像素大小,对几种45nm和55nm DRAM掩膜层进行了传统透射光学工具和反射光学工具的特性和灵敏度比较。该反射式光学工具工作距离短,灵敏度与透射式光学工具相当。用于45nm DRAM的掩模可以通过目前的艺术检测工具进行认证。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Mask inspection method for 45nm node device
Sensitivity of newly developed photo mask inspection tool with reflective optic was evaluated for 45nm DRAM device. To get the required defect sensitivity of mask, printability of mask defect on wafer were simulated using in house simulation tool. Simulation results were compared with inspection results. Characteristic and sensitivity comparison between conventional transmissive and reflective optic tools were evaluated for several types of mask layer of 45nm and 55nm DRAM according to pixel size of detector of inspection tools. This reflective optic with short working distance was equivalent in sensitivity to transmissive optic tool. Mask for 45nm DRAM can be qualified by current status of the art inspection tools.
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