并发测试实现

Shawn Molavi, Toby McPheeters
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引用次数: 5

摘要

今天的大型SOC设备包括许多不同的IP块,依次进行测试,增加了生产流程的测试时间。并行测试多个设备是减少每个设备测试时间和成本的一种方法。然而,随着更多的功能被添加到soc中,引脚数将增加,并限制了可以并行测试的站点数量。减少每台设备测试时间的一种方法是同时测试设备的多个区域。并发测试是一种并行测试设备各部分的方法。本文将讨论三种不同类型的并行测试。第一种类型的并发测试利用ATE的每引脚电子器件并行执行直流或频率测量测试。一个例子是同时运行几个锁相环时钟测试。第二种类型的并发测试利用设备的DFT模式在不同的IP块上执行并发测试。这方面的一个例子是同时执行耗时的数字测试(如扫描)和模拟测试(如RF调谐器或串行ATA)。第三种减少测试时间的方法是在之前的结果还在计算的时候开始一个新的测试。可以在执行其他测试的同时处理捕获的数据。这可以应用于adc或dac的输出,其中大量数据由ATE中的一个或多个嵌入式处理器处理,而随后的测试正在运行。其中一些技术需要在设计时实现DFT,以允许多个块同时且相互独立地工作。测试板的设计也必须仔细考虑并发测试。ATE将发挥关键作用,因为它必须在硬件和软件中支持并发测试特性。实现并行测试将带来更高的吞吐量和更低的测试成本,这是每个半导体公司保持竞争力所必须获得的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Concurrent Test Implementations
Today's large SOC devices include many different IP blocks which tested sequentially add significant test time to the production flow. Testing of several devices in parallel is one way to reduce test time and cost per device. However, as more functionality is added to the SOCs, the pin count will increase and limit the number of sites that can be tested in parallel. One method to reduce test time per device is to concurrently test multiple areas of the device at the one time. Concurrent test is a methodology to test various sections of the device in parallel. This paper will discuss three different types of concurrent test. The first type of concurrent test takes advantage of the ATE's per pin electronics to perform DC or frequency measure tests in parallel. One example is running several PLL clock tests at once. A second type of concurrent test makes use of the device's DFT modes to execute simultaneous tests on different IP blocks. An example of this is executing time consuming digital tests like scan concurrently with analog tests like RF tuners or serial ATA. A third method to reduce test time is to start a new test while the previous results are still being calculated. Processing captured data can be done at the same time other tests are being executed. This could be applied to the outputs of ADCs or DACs where large amounts of data are processed by one or more embedded processors in the ATE while subsequent tests are running. Some of these techniques require the implementation of DFT at design time to allow multiple blocks to function simultaneously and independently of each other. The test board must also be designed with careful consideration to concurrent test. The ATE will play a key role in that it must support concurrent test features in its hardware and software. Implementing concurrent test will result in higher throughput and lower test cost which every semiconductor company must obtain to stay competitive.
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