16.6 cm/sup /单片多处理器系统成品率提高的激光重构

H. Schroder, T. Hillmann-Ruge, J. Otterstedt
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引用次数: 3

摘要

在冗余总线系统中,采用准分子激光形成的连接和导体线的不连续来重新配置一个由9个相同的可编程视频信号处理元件组成的16.6 cm/sup /单片大面积集成多处理器系统。功能处理器的产率提高了13.3%。在两个原型上,总线系统的激光重新配置导致每个芯片在66 MHz下有4个功能处理器,每个多处理器系统提供4 GOPS的峰值算术性能。对待机功耗高的有缺陷的处理器的电源供应用激光终止,导致功耗减半。此外,为了改进激光工艺,在特殊的测试结构上,在两个具有不同标准CMOS层序的芯片上形成两个金属化层之间的垂直链接。对于形成的垂直连接的屈服统计,接触电阻R/sub / K/> / 3 /spl ω /被视为失效。激光加工面积为14/spl倍/14 /spl亩/米/sup 2/的垂直连杆,成品率达到100%。除此之外,还进行了常规的加速寿命测试,以检查激光形成的垂直链接的可靠性。将布莱克方程外推到工作条件(100/spl℃,2.5 mA), 39年的故障率为0.1%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Laser reconfiguration for yield enhancement of a 16.6 cm/sup 2/ monolithic multiprocessor system
A 16.6 cm/sup 2/ monolithic large area integrated multiprocessor system comprising 9 identical programmable video signal processing elements was reconfigured by excimer laser formed connections and discontinuities of conductor lines in a redundant bus system. The yield enhancement of functional processors amounts to 13.3%. On two prototypes, the laser reconfiguration of the bus system led to 4 functional processors per chip at 66 MHz, providing a peak arithmetic performance of 4 GOPS per multiprocessor system. The power supply to defective processors with a high stand-by power consumption was terminated by laser, leading to a halving of power consumption. Furthermore, for the improvement of the laser process, vertical links between two metallization levels were formed on two chips with different standard CMOS layer sequences on special test structures. For the yield statistics of the formed vertical links, a contact resistance R/sub K/>3 /spl Omega/ was treated as a failure. With the laser processing of vertical links with an area of 14/spl times/14 /spl mu/m/sup 2/, a yield of 100% has been achieved. Beyond those, conventional accelerated life time tests were performed to examine the reliability of laser formed vertical links. An extrapolation of Black's equation to operating conditions (100/spl deg/C, 2.5 mA) resulted in a failure rate of 0.1% in 39 years.
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