无附入式散热片板级QFP的热性能检验

Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) Pub Date : 2004-12-08 DOI:10.1109/EPTC.2004.1396573

T. Wang, Chang-Chi Lee, Y. Lai

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引用次数: 4

摘要

我们用数值方法评估了带有非附加式散热器的QFP的板级热性能。通过结合接触法的三维热-力耦合分析，对模具进行了功率计算，计算了散热片与模垫之间非附着界面的热-力变形及相应的间隙分布。对不同界面条件下封装的热性能进行了测试和比较。

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Examination of thermal performance of board-level QFP with unattached drop-in heat spreader

We evaluate the board-level thermal performance of QFP with an unattached drop-in heat spreader numerically. The die is given a power and induced thermomechanical deformations and corresponding gap distributions on the unattached interface between the heat spreader and the die pad are calculated through the 3D thermal-mechanical coupling analysis incorporated with contact methodologies. Thermal performances of the package with different interfacial conditions are examined and compared.

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Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)

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