一种创建再包装载体包的新方法

2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Pub Date : 2018-07-01 DOI:10.1109/IPFA.2018.8452586

Homg-Chang Liu, Chun-Hsiung Chung, Shou-Ming Huang

{"title":"一种创建再包装载体包的新方法","authors":"Homg-Chang Liu, Chun-Hsiung Chung, Shou-Ming Huang","doi":"10.1109/IPFA.2018.8452586","DOIUrl":null,"url":null,"abstract":"In the past, chemical acid was used to etch out remaining compound on the lead frame to create carrier package for repackage. As an artifact of the process, the silver coating which is needed for a reliable thermosonic bonding is also damaged or etched. This is not acceptable when analyzing failure device. By developing new method in removing the remaining compound after laser ablation, a good carrier package can be produced by submerging device into ethanol and removing remaining compound by polishing fleece.","PeriodicalId":382811,"journal":{"name":"2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","volume":"3 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A New Method in Creating Carrier Package for Repackage\",\"authors\":\"Homg-Chang Liu, Chun-Hsiung Chung, Shou-Ming Huang\",\"doi\":\"10.1109/IPFA.2018.8452586\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In the past, chemical acid was used to etch out remaining compound on the lead frame to create carrier package for repackage. As an artifact of the process, the silver coating which is needed for a reliable thermosonic bonding is also damaged or etched. This is not acceptable when analyzing failure device. By developing new method in removing the remaining compound after laser ablation, a good carrier package can be produced by submerging device into ethanol and removing remaining compound by polishing fleece.\",\"PeriodicalId\":382811,\"journal\":{\"name\":\"2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"volume\":\"3 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2018-07-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IPFA.2018.8452586\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2018.8452586","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 0

摘要

在过去，化学酸是用来蚀刻剩下的化合物在引线框架上，以创建载体包装，重新包装。作为该工艺的产物，可靠的热超声键合所需的银涂层也被损坏或蚀刻。在分析故障设备时，这是不可接受的。提出了一种去除激光烧蚀后残留化合物的新方法，将器件浸入乙醇中，通过抛光羊毛去除残留化合物，可以得到良好的载流子包。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

A New Method in Creating Carrier Package for Repackage

In the past, chemical acid was used to etch out remaining compound on the lead frame to create carrier package for repackage. As an artifact of the process, the silver coating which is needed for a reliable thermosonic bonding is also damaged or etched. This is not acceptable when analyzing failure device. By developing new method in removing the remaining compound after laser ablation, a good carrier package can be produced by submerging device into ethanol and removing remaining compound by polishing fleece.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

自引率

0.00%

发文量