面板级封装的最佳点在哪里?

2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 2019-05-21 DOI:10.23919/LTB-3D.2019.8735124

T. Braun, K. Becker, O. Hoelck, S. Voges, M. Woehrmann, L. Boettcher, M. Toepper, L. Stobbe, R. Aschenbrenner, M. Schneider-Ramelow, K. Lang

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引用次数: 0

摘要

扇出晶圆级封装(FOWLP)是微电子领域最新的封装趋势之一。除了异构集成的技术发展，包括多模封装、封装中的被动元件集成和再分配层或封装上的封装方法，更大的矩形基板格式也是目标。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Where is the Sweet Spot for Panel Level Packaging?

Fan-out Wafer Level Packaging (FOWLP) is one of the latest packaging trends in microelectronics. Besides technology developments towards heterogeneous integration including multiple die packaging, passive component integration in package and redistribution layer or package-on-package approaches also larger rectangular substrates formats are targeted.

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2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

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