低温临时键合微流控器件在生命科学中的应用研究

2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 2021-10-05 DOI:10.1109/LTB-3D53950.2021.9598407

Yang Han, C. Dang, Evert Visker, J. Visker, Aurelie Humbertv, Lan Peng

{"title":"低温临时键合微流控器件在生命科学中的应用研究","authors":"Yang Han, C. Dang, Evert Visker, J. Visker, Aurelie Humbertv, Lan Peng","doi":"10.1109/LTB-3D53950.2021.9598407","DOIUrl":null,"url":null,"abstract":"This study investigates the effect of low-temperature temporary bonding on thickness uniformity, back grinding, and glue removal after debonding. 140 °C proves to be compatible with backside processes and effectively facilitates glue removal for microfluidic devices used in lifescience applications.","PeriodicalId":198318,"journal":{"name":"2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2021-10-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Investigation on Low-temperature Temporary Bonding for Microfluidic Devices in Lifescience Applications\",\"authors\":\"Yang Han, C. Dang, Evert Visker, J. Visker, Aurelie Humbertv, Lan Peng\",\"doi\":\"10.1109/LTB-3D53950.2021.9598407\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This study investigates the effect of low-temperature temporary bonding on thickness uniformity, back grinding, and glue removal after debonding. 140 °C proves to be compatible with backside processes and effectively facilitates glue removal for microfluidic devices used in lifescience applications.\",\"PeriodicalId\":198318,\"journal\":{\"name\":\"2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2021-10-05\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/LTB-3D53950.2021.9598407\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/LTB-3D53950.2021.9598407","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 0

摘要

研究了低温临时粘接对厚度均匀性、背磨和脱粘后除胶的影响。140°C被证明与背面工艺兼容，并有效地促进了生命科学应用中使用的微流体装置的胶水去除。

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Investigation on Low-temperature Temporary Bonding for Microfluidic Devices in Lifescience Applications

This study investigates the effect of low-temperature temporary bonding on thickness uniformity, back grinding, and glue removal after debonding. 140 °C proves to be compatible with backside processes and effectively facilitates glue removal for microfluidic devices used in lifescience applications.

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2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

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