数字集成电路中物理缺陷回注为门级实际故障

M. Calha, Marcelino B. Santos, F. Gonçalves, I. Teixeira, João Paulo Teixeira
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引用次数: 13

摘要

集成电路的复杂性将设计活动向上推进,进入更高的抽象层次。产品质量要求测试活动向下移动,下降到集成电路的物理水平。高质量的测试需要覆盖物理缺陷的能力。然而,电路的复杂性使得测试准备,在晶体管的水平,令人望而却步。提出了一种将物理缺陷反标注为门级实际故障的方法。选择桥接故障,因为它们是当今工艺线中最可能出现的故障。结果表明,与路由模式相关联的实际故障可以用来表示整个故障集,从而导致对缺陷级别的准确评估,并用作测试质量指示器。提出了一种从集成电路布局中生成门级真实故障列表的方法,并通过仿真结果进行了验证。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Back annotation of physical defects into gate-level, realistic faults in digital ICs
IC complexity moves the design activity upwards, into higher levels of abstraction. Product quality requires the move of test activity downwards, down to IC physical level. High quality test requires the ability to cover physical defects. However, circuit complexity makes test preparation, at transistor level, prohibitive. A methodology for back annotation of physical defects into gate level realistic faults, is proposed in this paper. Bridging faults are selected, as they are the most likely faults in present-day process lines. It is shown that realistic faults, associated with routing patterns, can be used to represent the overall fault set, leading to an accurate evaluation of the defect level, used as the test quality indicator. A method to generate gate-level, realistic fault lists from the IC layout is presented, and is validated by simulation results.
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