演示了一种低于0.03 um2的高密度6-T SRAM,该SRAM具有用于超过10nm节点的移动SOC应用的缩放体finfet

Shien-Yang Wu, C. Y. Lin, M. Chiang, J. Liaw, J. Cheng, C. H. Chang, V. Chang, K. Pan, C. Tsai, C. Yao, T. Miyashita, Y. Wu, K. Ting, C. Hsieh, R. F. Tsui, R. Chen, C. Yang, H. Chang, C. Lee, K. Chen, Y. Ku, S. Jang
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引用次数: 21

摘要

我们首次展示了文献中报道的最小的,全功能的32Mb 6-T高密度SRAM,用于10nm以上节点的CMOS技术的缩放体finfet。缩放后的FinFET器件具有良好的静电性能,DIBL < 45mV/V,亚阈值摆幅< 65mV/ 10,驱动电流具有竞争力。对于工作电压低至0.45V的高密度SRAM,静态噪声裕度可达~90mV。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Demonstration of a sub-0.03 um2 high density 6-T SRAM with scaled bulk FinFETs for mobile SOC applications beyond 10nm node
For the first time, we demonstrate the smallest, fully functional 32Mb 6-T high density SRAM reported in literature with scaled bulk FinFETs for CMOS technology beyond 10nm node. Scaled FinFET devices exhibit excellent electrostatic with DIBL of <;45mV/V and sub-threshold swing of <;65mV/decade and competitive drive current. Static noise margin of ~90mV for the high density SRAM operated down to 0.45V is achieved.
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