{"title":"28nm移动应用中睡眠模式IDDQ失效分析","authors":"G. Qian, Parker Miao, SoonFatt Ng","doi":"10.1109/IPFA.2016.7564240","DOIUrl":null,"url":null,"abstract":"Through the investigation of sleep mode IDDQ failure encounter in fabrication of a 28nm mobile application IC, this paper will demonstrate the Failure analysis techniques applicable for leakage source detection involving activation of power management feature rather than pure DC bias, we will also discuss the potential process/design weak point and proposed solution in deep submicron technology node.","PeriodicalId":206237,"journal":{"name":"2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","volume":"33 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-07-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Sleep mode IDDQ failure analysis in 28nm mobile application\",\"authors\":\"G. Qian, Parker Miao, SoonFatt Ng\",\"doi\":\"10.1109/IPFA.2016.7564240\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Through the investigation of sleep mode IDDQ failure encounter in fabrication of a 28nm mobile application IC, this paper will demonstrate the Failure analysis techniques applicable for leakage source detection involving activation of power management feature rather than pure DC bias, we will also discuss the potential process/design weak point and proposed solution in deep submicron technology node.\",\"PeriodicalId\":206237,\"journal\":{\"name\":\"2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"volume\":\"33 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-07-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IPFA.2016.7564240\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2016.7564240","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Sleep mode IDDQ failure analysis in 28nm mobile application
Through the investigation of sleep mode IDDQ failure encounter in fabrication of a 28nm mobile application IC, this paper will demonstrate the Failure analysis techniques applicable for leakage source detection involving activation of power management feature rather than pure DC bias, we will also discuss the potential process/design weak point and proposed solution in deep submicron technology node.