WLCSP后端注意事项

IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology Symposium, 2003. IEMT 2003. Pub Date : 2003-07-16 DOI:10.1109/IEMT.2003.1225896

T. Tessier, W. S. Shin, Y. Yuen, B.T. Do, F. Kuan, J. Ling

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引用次数: 0

摘要

wlcsp在各种形式因素敏感的封装应用中的快速采用正在进行中。迄今为止，由于缺乏强大的基础设施来实现其高容量可用性，该技术部署的步伐已经放缓。本文将重点介绍与当前WLCSP供应基础相关的一些问题，以及正在进行的全面交钥匙服务以支持这种封装技术的努力。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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WLCSP back-end considerations

The rapid adoption of WLCSPs in a wide range of form factor sensitive packaging applications is underway. To date, the pace of this technology deployment has been slowed by the absence of a robust infrastructure to enable its availability in high volumes. This paper will highlight some of the issues associated with the current WLCSP supply base and efforts that are underway to put in place full turn-key services to support this packaging technology.

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来源期刊

IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology Symposium, 2003. IEMT 2003.

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