高效的系统级老化预测

N. Hatami, R. Baranowski, P. Prinetto, H. Wunderlich
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引用次数: 6

摘要

集成电路的非功能特性包括可靠性、脆弱性、功耗和散热。由于模拟成本过高,在长时间的系统运行中准确预测NFP是一个巨大的挑战。例如,在老化估计方面,现有的低级模型是准确的,但对于复杂设计的仿真来说,效率不够高。另一方面,现有的快速高级模拟技术不能为NFP分析提供足够的细节。本文的目标是通过将低级模型的准确性与高级仿真速度相结合来弥合这一差距。我们介绍了一种有效的混合级NFP预测方法,该方法同时考虑了系统的结构和应用。系统在事务级建模,以实现高仿真速度。为了保持准确性,在门级通过周期精确模拟对分析岩心进行NFP评估。我们提出了有效的跨级同步和空闲仿真加速技术。以负偏置温度失稳引起的老化分析为例,对可靠性热点进行了识别。作为案例研究,分析了SoC平台上的几个应用。与传统方法相比,该方法的速度提高了7 ~ 400倍,平均误差低于0.006%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Efficient system-level aging prediction
Non-functional properties (NFPs) of integrated circuits include reliability, vulnerability, power consumption or heat dissipation. Accurate NFP prediction over long periods of system operation poses a great challenge due to prohibitive simulation costs. For instance, in case of aging estimation, the existing low-level models are accurate but not efficient enough for simulation of complex designs. On the other hand, existing techniques for fast high-level simulation do not provide enough details for NFP analysis. The goal of this paper is to bridge this gap by combining the accuracy of low-level models with high-level simulation speed. We introduce an efficient mixed-level NFP prediction methodology that considers both the structure and application of a system. The system is modeled at transaction-level to enable high simulation speed. To maintain accuracy, NFP assessment for cores under analysis is conducted at gate-level by cycle-accurate simulation. We propose effective techniques for cross-level synchronization and idle simulation speed-up. As an example, we apply the technique to analyze aging caused by Negative Bias Temperature Instability in order to identify reliability hot spots. As case studies, several applications on an SoC platform are analyzed. Compared to conventional approaches, the proposed method is from 7 up to 400 times faster with mean error below 0.006%.
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