高频外延封装单驱动四质量三轴谐振音叉陀螺仪

2016 IEEE 29th International Conference on Micro Electro Mechanical Systems (MEMS) Pub Date : 2016-02-29 DOI:10.1109/MEMSYS.2016.7421784

S. Wisher, P. Shao, A. Norouzpour-Shirazi, Y. Yang, E. Ng, I. Flader, Y. Chen, D. Heinz, T. Kenny, F. Ayazi

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引用次数: 10

摘要

本文介绍了一种单驱动工作模式的高频谐振三轴音叉陀螺仪。该四质量器件在2×2 mm2真空封装模具上实现，采用外延密封工艺制造，使其成为最小的晶圆级封装3轴陀螺仪之一。与传统的谐振式TFGs相比，谐振频率设计得相对较高(~138 kHz)，允许模式匹配操作的高带宽，并增强对冲击和振动的抵抗。结果表明，对所有三个轴都具有灵敏度，z轴具有模式匹配操作，X轴和y轴具有模式分裂操作。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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A high-frequency epitaxially encapsulated single-drive quad-mass tri-axial resonant tuning fork gyroscope

This paper introduces a `high-frequency' resonant tri-axial tuning fork gyroscope (TFG) with a single-drive mode of operation. The quad-mass device is implemented on a 2×2 mm2 vacuum-packaged die fabricated using the epi-seal process, making this one of the smallest wafer-level packaged 3-axis gyros. In contrast to conventional resonant TFGs, the resonant frequencies are designed to be relatively high (~138 kHz) permitting high bandwidth for mode-matched operation and enhancing resistance to shock and vibration. The results show sensitivity to all three axes with mode-matched operation for the Z-axis and mode-split for the X- and Y-axes.

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2016 IEEE 29th International Conference on Micro Electro Mechanical Systems (MEMS)

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