TAPIR(集成冷却的紧凑型模块化电源模块)技术:目标与挑战

2021 Third International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) Pub Date : 2021-06-21 DOI:10.1109/3D-PEIM49630.2021.9497263

W. Bikinga, B. Mezrag, Y. Avenas, J. Schanen, J. Guichon, K. Alkama, L. Dupont, V. Bley, E. Vagnon

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引用次数: 1

摘要

本文研究了一种新型的电源模块紧凑型模块化技术，通过优化散热器的体积，采用集成冷却技术来减少电源转换器的整体重量/体积。它是基于基本开关单元的模块化组装。首先，该技术仅从热方面介绍。然后介绍了基本开关单元的多物理场设计。最后，对全局功率模块的制作和设计的各个方面进行了讨论。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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TAPIR (compacT and modulAr Power modules with IntegRated cooling) Technology: Goals and Challenges

This paper deals with a new compact and modular technology for power module, with integrated cooling to reduce the global weight/volume of power converters by optimizing the volume of the heat sink. It is based on the modular assembly of elementary switching cells. First the technology is introduced by only focusing on thermal aspects. Then the multiphysics design of elementary switching cells is described. Finally, various aspects concerning the fabrication and design of global power modules are discussed.

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2021 Third International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM)

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