导体表面积分方程建模的研究

2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2015-12-07 DOI:10.1109/EPEPS.2015.7347146

T. Xia, H. Gan, M. Wei, W. Chew

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引用次数: 0

摘要

介绍了一种用曲面积分方程求解导体问题的严密方法。该公式基于增广电场积分方程。为了对导体进行建模并准确地捕获损耗，对几种集成技术进行了分析和比较。线积分法将是求解导体问题的最佳选择。结合此技术后，此方法可应用于互连和封装问题。

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A study of conductor modeling using the surface integral equation

A rigorous method to solve conductor problems using the surface integral equation is introduced. This formulation is based on the augmented electric field integral equation. In order to model conductors and accurately capture the losses, some integration techniques are analyzed and compared. The line integral method will be an optimal option for conductor problems. After incorporating this technique, this method can be applied to interconnect and packaging problems.

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来源期刊

2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS)

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