在450°C电沉积铜TSV时不泵送

2016 International Conference on Electronics Packaging (ICEP) Pub Date : 2016-08-18 DOI:10.1109/ECTC.2016.337

K. Kondo

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引用次数: 0

摘要

1.添加剂A对电沉积铜TSV无泵送现象。2. 电线用电沉积铜TSV经450℃退火后的电阻率仅为传统电沉积铜的1.09。3.在PCB的焊料回流温度为230°C时，TEC降低了34%。在200℃，60min的条件下，添加添加剂B. 4进行第二次退火，还原率达到34%。退火后PCB铜的电阻率仅为传统电沉积铜的1.32。

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No pumping at 450°C with electrodeposited copper TSV

1.The additive A shows no pumping with electrodeposited copper TSV. 2. The resistivity of electrodeposited copper TSV after 450°C annealing for the wiring is only 1.09 of conventional electrodeposited copper. 3.The 34% TEC reduction has been realized at 230°C for solder reflow temperature for PCB. The 34% reduction has been obtained after the second annealing after 200°C, 60min with the additive B. 4.The resistivity of PCB copper after annealing is only 1.32 of conventional electrodeposited copper.

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2016 International Conference on Electronics Packaging (ICEP)

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