一个紧凑的,基于变压器的60 GHz SPDT射频开关,利用二极管连接的SiGe hbt

R. Schmid, P. Song, J. Cressler
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引用次数: 7

摘要

这项工作描述了一种紧凑的60 GHz SPDT RF开关的设计,该开关利用二极管连接的SiGe hbt。在毫米波频率下,SiGe hbt比CMOS表现出更好的Roff/Ron比,可用于提高开关性能。基于变压器的开关拓扑结构可实现占地面积为190 μm × 225 μm的SPDT器件。讨论了变压器的设计,提出了一种优化开关匹配元件的方法。该开关在180 nm SiGe BiCMOS技术平台上制造,具有fT/fmax为240/260 GHz的HBTs。该开关在60 GHz时实现2.7 dB插入损耗和14 dB隔离,P1dB和IIP3分别为13.8 dBm和23.8 dBm。与50 GHz的类似90 nm CMOS开关相比,这意味着插入损耗提高了20%。该开关还可以帮助实现收发模块的内置自检(BIST)功能。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A compact, transformer-based 60 GHz SPDT RF switch utilizing diode-connected SiGe HBTs
This work describes the design of a compact 60 GHz SPDT RF switch utilizing diode-connected SiGe HBTs. At mm-wave frequencies, SiGe HBTs demonstrate better Roff/Ron ratios than CMOS and can be used to improve switch performance. A switch topology using a transformer is developed to create a SPDT with a small foot print of 190 μm × 225 μm. The transformer design is discussed and a methodology is presented to optimize the matching components of the switch. The switch is fabricated on a 180 nm SiGe BiCMOS technology platform featuring HBTs with an fT/fmax of 240/260 GHz. The switch achieves 2.7 dB insertion loss and 14 dB isolation at 60 GHz with a P1dB and IIP3 of 13.8 dBm and 23.8 dBm, respectively. This represents a 20% improvement in insertion loss in comparison to a similar 90 nm CMOS switch at 50 GHz. It is also shown that the proposed switch can help enable built-in-self-test (BIST) functionality for transmit-receive modules.
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