偏置hast后PCB上的泄漏/短路案例研究

2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Pub Date : 2016-07-18 DOI:10.1109/IPFA.2016.7564262

Ke-Ying Lin, Sharon Chen

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引用次数: 0

摘要

在将WLCSP器件安装在PCB上进行HAST测试后，观察到多次短路和漏电故障。采用非破坏性技术——锁定热成像技术(LIT)对PCB板上的故障进行定位。然后进行物理失效分析(PFA)。结果表明，PCB焊点之间的焊料污染是导致故障的原因。

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Case study of leakage/short on PCB after biased-HAST

After HAST of WLCSP devices mounted on PCB, several short and leakage failures were observed. Non-destructive technique, lock-in thermography (LIT) was applied to localize the fault on PCB. Thereafter, physical failure analysis (PFA) was performed. It revealed solder contamination between the solder bumps of PCB as cause of the failures.

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2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

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