{"title":"自动实现动态电迁移测试","authors":"Wei Zhang, Y.H. Cheng, Z.G. Li, W.L. Guo, Y.H. Sun, X.X. Li","doi":"10.1109/ICMTS.1995.513980","DOIUrl":null,"url":null,"abstract":"A computer controlled testing system built up with hp instruments is described for dynamic electromigration characterization under constant and pulsed DC stressing. Two specially designed specimens with built-in temperature sensor are also presented in cooperation with the system. A series of electromigration tests was performed in terms of current, temperature and frequency ramps. Typical experimental results are discussed in this paper.","PeriodicalId":432935,"journal":{"name":"Proceedings International Conference on Microelectronic Test Structures","volume":"41 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1995-03-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"An automatic implementation of dynamic electromigration tests\",\"authors\":\"Wei Zhang, Y.H. Cheng, Z.G. Li, W.L. Guo, Y.H. Sun, X.X. Li\",\"doi\":\"10.1109/ICMTS.1995.513980\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A computer controlled testing system built up with hp instruments is described for dynamic electromigration characterization under constant and pulsed DC stressing. Two specially designed specimens with built-in temperature sensor are also presented in cooperation with the system. A series of electromigration tests was performed in terms of current, temperature and frequency ramps. Typical experimental results are discussed in this paper.\",\"PeriodicalId\":432935,\"journal\":{\"name\":\"Proceedings International Conference on Microelectronic Test Structures\",\"volume\":\"41 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1995-03-22\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings International Conference on Microelectronic Test Structures\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICMTS.1995.513980\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings International Conference on Microelectronic Test Structures","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICMTS.1995.513980","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
An automatic implementation of dynamic electromigration tests
A computer controlled testing system built up with hp instruments is described for dynamic electromigration characterization under constant and pulsed DC stressing. Two specially designed specimens with built-in temperature sensor are also presented in cooperation with the system. A series of electromigration tests was performed in terms of current, temperature and frequency ramps. Typical experimental results are discussed in this paper.
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