具有扇出能力的金属晶片WLCSP技术的析因分析

2006 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits Pub Date : 2006-07-03 DOI:10.1109/IPFA.2006.251035

M. Yew, C. Yuan, C.N. Han, C.S. Huang, W. Yang, K. Chiang

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引用次数: 9

摘要

本研究提出一种晶圆级晶片缩放封装(WLCSP)，具有重新分配电路的能力，以解决将细晶片组装到粗晶片上的问题。在扇形WLCSP中，焊料凸起可以位于填充聚合物和芯片表面。介绍了扇形输出WLCSP的概念和制作这种新型扇形输出WLCSP的过程。此外，采用二维有限元模型描述了扇形外露式WLCSP在封装级的可靠性特性。用方差分析(ANOVA)进行了25个因子设计，以获得包装的敏感性信息

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Factorial Analysis of Chip-on-Metal WLCSP Technology with Fan-Out Capability

In this study, a wafer level chip scaled packaging (WLCSP) having the capability of redistributing the electrical circuit is proposed to resolve the problem of assembling a fine-pitched chip to a coarse-pitched substrate. In the fan-out WLCSP, the solder bumps could be located on both the filler polymer and chip surface. The concept of the fan-out WLCSP and the processes of fabricating the novel fan-out WLCSP would be described. In addition, the reliability characteristic of the fan-out WLCSP in packaging level is described by using the two-dimensional finite element model. The 25 factorial designs with the analysis of variance (ANOVA) are conducted to obtain the sensitivity information of the packaging

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2006 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits

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