Erik E. Lorenz, Joshua Gehre, L. Jäckel, J. Schuster
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Film Growth from Particle Raytracing: A Simulation Method for Vapor Deposition Processes with Changing Surface Topographies
We present a numerical method for the simulation of vapor deposition processes in complex 3D microstructures, which couples a raytracing-based particle Monte Carlo transport model with Level Set methods for thin film growth. Through the incorporation of different particle-surface interaction models, our method models a wide range of deposition techniques, including Physical Vapor Deposition (PVD), Chemical Vapor Deposition and Atomic Layer Deposition (ALD). We demonstrate our method on trench filling with a two-step copper resputter PVD process and a model ALD process.