未充填下填料对跌落试验及热循环可靠性的影响

2005 6th International Conference on Electronic Packaging Technology Pub Date : 2005-08-30 DOI:10.1109/ICEPT.2005.1564728

E. Ibe, K. Loh, J. Luan, T. Y. Tee

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引用次数: 1

摘要

本文研究了下填料对区域阵列封装(如BGA、CSP和WL-CSP)跌落测试和热循环可靠性的影响。发现未填充的下填料提供了优越的跌落试验性能。发现二氧化硅填充的下填料具有优越的热循环性能。然而，如果未填充的下填料提供了足够的热循环性能，它的使用产生了实质性的工艺效益。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Effect of unfilled underfill on drop test and thermal cycle reliability

The work reported here explores the effect of underfill encapsulants on drop test and thermal cycle reliability of area array packages, such as BGA's, CSP's, and WL-CSP's. An unfilled underfill was found to provide superior drop test performance. Silica filled underfill was found to provide superior thermal cycle performance. However, if the unfilled underfill provides adequate thermal cycle performance, its use yields substantial process benefits.

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2005 6th International Conference on Electronic Packaging Technology

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