电路结构级单事件暂态抑制的实验表征与应用

K.C. Mohr, L. Clark
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引用次数: 8

摘要

本文描述了过程单事件暂态(SET)性能作为电路节点电容和驱动强度函数的实验表征。本文描述了一种基于130 nm块体CMOS工艺的测试结构。本文还介绍了离子束测量结构的实验结果。结果可以在设计周期的早期使用,以限制由于set造成的可靠性影响。SRAM设计示例演示了如何使用测量的SET数据来权衡动态功耗以改善软误差性能,而不增加电路面积。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Experimental Characterization and Application of Circuit Architecture Level Single Event Transient Mitigation
In this work experimental characterization of process single event transient (SET) performance as a function of circuit node capacitance and drive strength is described. A test structure fabricated on a 130 nm bulk CMOS process is described. Experimental results from ion beam measurements on the structure are also presented. The results can be used early in the design cycle to limit reliability impact due to SETs. An SRAM design example demonstrates how measured SET data can be used to trade off dynamic power dissipation for improved soft error performance without increasing circuit area.
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