一种W-CDMA直接转换IQ调制器模组的实现，包括评估晶片封装板的相互作用

56th Electronic Components and Technology Conference 2006 Pub Date : 2006-07-05 DOI:10.1109/ECTC.2006.1645891

F. Han, J. Wu, T. Horng, J. Lin, C.C. Tu

{"title":"一种W-CDMA直接转换IQ调制器模组的实现，包括评估晶片封装板的相互作用","authors":"F. Han, J. Wu, T. Horng, J. Lin, C.C. Tu","doi":"10.1109/ECTC.2006.1645891","DOIUrl":null,"url":null,"abstract":"This paper presents a W-CDMA direct-conversion IQ modulator MMIC design that employs a new technique to generate the 90deg phase shift with low implementation loss. The package and PCB effects on the implemented IQ modulator MMIC when further developed as a board module are studied. The package and PCB interconnects are analyzed using the 3-D EM simulation tool and transformed into the equivalent-circuit elements for co-simulation with the IQ modulator MMIC. The degradation of error vector magnitude and sideband suppression due to the presence of package and PCB can be well predicted by the co-simulation results and then verified by the final measurement results","PeriodicalId":194969,"journal":{"name":"56th Electronic Components and Technology Conference 2006","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-07-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Implementation of a W-CDMA direct-conversion IQ modulator module including evaluation of chip-package-board interactions\",\"authors\":\"F. Han, J. Wu, T. Horng, J. Lin, C.C. Tu\",\"doi\":\"10.1109/ECTC.2006.1645891\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents a W-CDMA direct-conversion IQ modulator MMIC design that employs a new technique to generate the 90deg phase shift with low implementation loss. The package and PCB effects on the implemented IQ modulator MMIC when further developed as a board module are studied. The package and PCB interconnects are analyzed using the 3-D EM simulation tool and transformed into the equivalent-circuit elements for co-simulation with the IQ modulator MMIC. The degradation of error vector magnitude and sideband suppression due to the presence of package and PCB can be well predicted by the co-simulation results and then verified by the final measurement results\",\"PeriodicalId\":194969,\"journal\":{\"name\":\"56th Electronic Components and Technology Conference 2006\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2006-07-05\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"56th Electronic Components and Technology Conference 2006\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.2006.1645891\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"56th Electronic Components and Technology Conference 2006","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.2006.1645891","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 0

摘要

本文提出了一种W-CDMA直接转换IQ调制器的MMIC设计，该调制器采用了一种新的技术，产生90度相移，实现损耗低。研究了封装和PCB对实现的IQ调制器MMIC进一步发展为板模块的影响。利用三维电磁仿真工具对封装和PCB互连进行了分析，并将其转换为等效电路元件，与IQ调制器MMIC进行了联合仿真。由于封装和PCB的存在，误差矢量幅度和边带抑制的退化可以通过联合仿真结果很好地预测，然后通过最终的测量结果进行验证

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Implementation of a W-CDMA direct-conversion IQ modulator module including evaluation of chip-package-board interactions

This paper presents a W-CDMA direct-conversion IQ modulator MMIC design that employs a new technique to generate the 90deg phase shift with low implementation loss. The package and PCB effects on the implemented IQ modulator MMIC when further developed as a board module are studied. The package and PCB interconnects are analyzed using the 3-D EM simulation tool and transformed into the equivalent-circuit elements for co-simulation with the IQ modulator MMIC. The degradation of error vector magnitude and sideband suppression due to the presence of package and PCB can be well predicted by the co-simulation results and then verified by the final measurement results

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56th Electronic Components and Technology Conference 2006

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