手机应用的无铅焊料工艺开发和可靠性

Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Pub Date : 2005-03-16 DOI:10.1109/ISAPM.2005.1432056

S. Zhu, C. Nguyen

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引用次数: 1

摘要

最近世界范围内的无铅活动一直在推动国际和美国消费电子公司无铅。本文指出了实现手机应用无铅焊接工艺的挑战、关键问题和解决方案，并描述了在手机制造中Sn/Ag/Cu和Sn/Ag/Bi焊料、工艺开发和可靠性结果的研究。本文描述了润湿性、印刷性和回流性结果、电气特性、跌落冲击、热循环试验、湿度试验和机械可靠性结果。本文还讨论了过程DOE结果。采用传统共晶焊料作为基准进行比较。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Lead free solder process development and reliability for handset application

Recent worldwide lead free activity has been driving international and US consumer electronic companies to be lead free. This paper identifies the challenges, critical issues and solutions for implementing lead free soldering process for handset application, and describes the studies conducted on Sn/Ag/Cu and Sn/Ag/Bi solder, process development and reliability results for handset manufacturing. The paper described wettability, printability and reflow results, electrical characterization, drop shock, thermal cycling test, humidity test and mechanical reliability results. Process DOE results are also discussed in the paper. Traditional eutectic solder is used as the baseline for comparison.

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Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005.

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