{"title":"用于无线多无线电的系统级封装(SiP)模块","authors":"M. Martin, H. Pohjonen","doi":"10.1109/ECTC.2006.1645831","DOIUrl":null,"url":null,"abstract":"Mobile devices: phones, terminals, PDAs etc. includes an increasing number of methods of cellular access, such as: GSM, WCDMA, CDMA etc. and complementary cellular wireless access such as: WLAN, BT, positioning, receiving and broadcasting capability. This paper analyzes how system in package (SiP) can be utilized in multiradio wireless access mobile devices, and what characteristics are needed in such SiPs to provide future mobile devices with wireless access. Guidelines and directions are presented to aid in the design and partitioning of SiPs. The embeddation of IC(s) die inside a SiP module interposer, the reduced need for the traditional type of shielding of the total system, and the option to include passive components with high performance requirements as SMD parts inside SiPs are options to achieve a 50% area and thickness reduction. A minimal number of implementation technologies and materials, I/Os and part count reduction by about 50 % may also result","PeriodicalId":194969,"journal":{"name":"56th Electronic Components and Technology Conference 2006","volume":"8 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-07-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"System-in-package (SiP) modules for wireless multiradio\",\"authors\":\"M. Martin, H. Pohjonen\",\"doi\":\"10.1109/ECTC.2006.1645831\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Mobile devices: phones, terminals, PDAs etc. includes an increasing number of methods of cellular access, such as: GSM, WCDMA, CDMA etc. and complementary cellular wireless access such as: WLAN, BT, positioning, receiving and broadcasting capability. This paper analyzes how system in package (SiP) can be utilized in multiradio wireless access mobile devices, and what characteristics are needed in such SiPs to provide future mobile devices with wireless access. Guidelines and directions are presented to aid in the design and partitioning of SiPs. The embeddation of IC(s) die inside a SiP module interposer, the reduced need for the traditional type of shielding of the total system, and the option to include passive components with high performance requirements as SMD parts inside SiPs are options to achieve a 50% area and thickness reduction. A minimal number of implementation technologies and materials, I/Os and part count reduction by about 50 % may also result\",\"PeriodicalId\":194969,\"journal\":{\"name\":\"56th Electronic Components and Technology Conference 2006\",\"volume\":\"8 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2006-07-05\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"56th Electronic Components and Technology Conference 2006\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.2006.1645831\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"56th Electronic Components and Technology Conference 2006","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.2006.1645831","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
System-in-package (SiP) modules for wireless multiradio
Mobile devices: phones, terminals, PDAs etc. includes an increasing number of methods of cellular access, such as: GSM, WCDMA, CDMA etc. and complementary cellular wireless access such as: WLAN, BT, positioning, receiving and broadcasting capability. This paper analyzes how system in package (SiP) can be utilized in multiradio wireless access mobile devices, and what characteristics are needed in such SiPs to provide future mobile devices with wireless access. Guidelines and directions are presented to aid in the design and partitioning of SiPs. The embeddation of IC(s) die inside a SiP module interposer, the reduced need for the traditional type of shielding of the total system, and the option to include passive components with high performance requirements as SMD parts inside SiPs are options to achieve a 50% area and thickness reduction. A minimal number of implementation technologies and materials, I/Os and part count reduction by about 50 % may also result
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