玻璃的原位测量和微加工

MHS'99. Proceedings of 1999 International Symposium on Micromechatronics and Human Science (Cat. No.99TH8478) Pub Date : 1999-11-23 DOI:10.1109/MHS.1999.820004

R. Wuthrich, V. Fascio, D. Viquerat, H. Langen

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引用次数: 45

摘要

采用电化学放电加工技术对玻璃基板进行微加工。开发的刀架允许扫描基材表面以及加工它在一个闭环。开发的钻孔控制算法允许实现相对较高的加工速度(高达30 /spl mu/m/s)和深度结构(高达1mm)。一步加工深度可达100 /spl μ m的微通道，去除率为4.5/spl / middot/10/sup 5/ /spl μ m/sup 3//s。报道了一些加工微孔、微通道和修改现有图案的实例。

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In situ measurement and micromachining of glass

Glass substrates were micromachined using electro chemical discharge machining. The developed tool holder allows to scan the substrate surface as well as machining it in a closed loop. The developed control algorithm for drilling holes allows to achieve relatively high machining speeds (up to 30 /spl mu/m/s) and deep structures (up to 1 mm). Micro-channels up to a depth of 100 /spl mu/m were machined in one step with a removal rate of 4.5/spl middot/10/sup 5/ /spl mu/m/sup 3//s. Reported are some examples of machining micro-holes, micro-channels and modification of existing pattering.

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MHS'99. Proceedings of 1999 International Symposium on Micromechatronics and Human Science (Cat. No.99TH8478)

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