{"title":"带光吸收器的绿色激光退火","authors":"K. Shibahara, A. Matsuno, E. Takii, T. Eto","doi":"10.1109/RTP.2005.1613689","DOIUrl":null,"url":null,"abstract":"To compensate deep penetration depth of green laser light into Si, metal absorber was formed on a specimen. TiN absorber was effective to reduce necessary laser energy density to activate dopant, however Mo worked oppositely. In addition, specimens with the absorber encountered the problem of over-melt that increased junction depth severely. Mechanisms of these results were discussed utilizing one-dimensional thermal diffusion analysis. Absence of reflectivity reduction was considered to be the key of this phenomenon","PeriodicalId":253409,"journal":{"name":"2005 13th International Conference on Advanced Thermal Processing of Semiconductors","volume":"32 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-10-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Green laser annealing with light absorber\",\"authors\":\"K. Shibahara, A. Matsuno, E. Takii, T. Eto\",\"doi\":\"10.1109/RTP.2005.1613689\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"To compensate deep penetration depth of green laser light into Si, metal absorber was formed on a specimen. TiN absorber was effective to reduce necessary laser energy density to activate dopant, however Mo worked oppositely. In addition, specimens with the absorber encountered the problem of over-melt that increased junction depth severely. Mechanisms of these results were discussed utilizing one-dimensional thermal diffusion analysis. Absence of reflectivity reduction was considered to be the key of this phenomenon\",\"PeriodicalId\":253409,\"journal\":{\"name\":\"2005 13th International Conference on Advanced Thermal Processing of Semiconductors\",\"volume\":\"32 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2005-10-04\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2005 13th International Conference on Advanced Thermal Processing of Semiconductors\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/RTP.2005.1613689\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2005 13th International Conference on Advanced Thermal Processing of Semiconductors","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/RTP.2005.1613689","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
To compensate deep penetration depth of green laser light into Si, metal absorber was formed on a specimen. TiN absorber was effective to reduce necessary laser energy density to activate dopant, however Mo worked oppositely. In addition, specimens with the absorber encountered the problem of over-melt that increased junction depth severely. Mechanisms of these results were discussed utilizing one-dimensional thermal diffusion analysis. Absence of reflectivity reduction was considered to be the key of this phenomenon