随机位值对SRAM单元NBTI寿命的影响

R. Wittmann, H. Puchner, H. Ceric, S. Selberherr
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引用次数: 6

摘要

公司通常通过外推直流退化来估计SRAM存储器的NBTI寿命。这种方法低估了存储单元的寿命,因为单元中比特随时间的变化被忽略了。在这项工作中,我们通过使用100%(完全不对称应力)和50%(对称应力)边界之间存储1位的概率,分析了在6T-SRAM存储单元中存储随机位值的影响。结果表明,在T2和T4之间的应力分裂中使用90%不对称的SRAM寿命比DC寿命长1.14倍。我们还证明,在高度不对称应力水平下,电池的NBTI降解收敛于DC降解,对于1位,概率超过90%。结果表明,校正后的反应扩散模型不仅可以用于研究NBTI对周期性矩形信号驱动门的响应,而且可以用于在SRAM单元中存储随机位序列
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Impact of Random Bit Values on NBTI Lifetime of an SRAM Cell
Companies estimate the NBTI lifetime of SRAM memories usually by extrapolation of the DC degradation. This method underestimates the lifetime of the memory cell since the bit change in the cell over time is neglected. In this work we have analyzed the impact of storing random bit values in a 6T-SRAM memory cell by using probabilities of storing a one bit between the boundaries of 100% (fully unsymmetric stress) and 50% (symmetric stress). It turned out that the SRAM lifetime for using an unsymmetry of 90% in the stress-split between T2 and T4 is 1.14 times longer than the DC lifetime. We have also demonstrated that the NBTI degradation of the cell converges to the DC degradation for highly unsymmetric stress levels with a probability of over 90% for a one bit. It turned out that the calibrated reaction-diffusion model is useful to study the NBTI response not only for driving the gate with periodic rectangular signals but also for storing random bit sequences in an SRAM cell
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