引线模块-引领下一个行业趋势，实现最佳的热性能和易用性

2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) Pub Date : 2010-11-01 DOI:10.1109/IEMT.2010.5746738

Woo Kuan Yee, L. Meng, Eugene Lee

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引用次数: 0

摘要

利用当今半导体行业的发展趋势，终端客户应用对模块封装的需求不断增长。这主要是由于系统封装作为一个完整的解决方案，易用性，小型化，增强热，EMI屏蔽和低成本IC封装的好处。

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Leaded module - steering the next industry trend for best in class thermal performance and ease of use

Leveraging semiconductor industry trend today, there is a massive growing demand for module package at end customers' application. This is essentially due to benefits from system in package as a complete solution for ease of use, miniaturization, enhanced thermal, EMI shielding and low cost IC packaging.

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来源期刊

2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT)

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