热电冷却新技术

Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (IEEE Cat. No.04CH37545) Pub Date : 2004-03-09 DOI:10.1109/STHERM.2004.1291295

J. Bass, D. Allen, S. Ghamaty, N. Elsner

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引用次数: 15

摘要

目前使用的热电冷却器的性能系数(COP)仅为0.5左右。相比之下，大型机器(如空调和冰箱)的cop水平为3.0至5.0。为了提高电子元件的冷却效率，出现了一种新的热电冷却技术。本文讨论了多层量子阱(MLQW)热电材料的新技术，它可以使目前用于电子冷却的热电冷却器的COP提高四到五倍。它还详细和更新了MLQW热电材料的实验工作，并将详细介绍预测的更高性能冷却的支持分析。提出了一种电子冷却模块配置的具体实例。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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New technology for thermoelectric cooling

Thermoelectric coolers in use today have a coefficient of performance (COP) of only about 0.5. This compares to COPS of larger scale machines, such as air conditioners and refrigerators at levels of 3.0 to 5.0. For electronic component cooling there is a new thermoelectric technology emerging for improved efficiency. This paper discusses this new technology which is multi-layer quantum well (MLQW) thermoelectrics, that should increase by four or five times the COP of present thermoelectric coolers used in electronic cooling applications. It also details and updates the experimental work in MLQW thermoelectric materials and will detail the supporting analysis of the predicted higher performance cooling. A specific example of an electronic cooling module configuration is presented.

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Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (IEEE Cat. No.04CH37545)

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