Dat Tran, L. Winemberg, D. Carder, X. Lin, Joe LeBritton, B. Swanson
{"title":"检测和诊断开放缺陷","authors":"Dat Tran, L. Winemberg, D. Carder, X. Lin, Joe LeBritton, B. Swanson","doi":"10.1109/TEST.2010.5699303","DOIUrl":null,"url":null,"abstract":"One of the common failures found in manufactured ICs are interconnect opens. While stuck-at and transition fault automatic test pattern generation (ATPG) patterns can detect open defects, these fault models do not catch all of them. This poster describes a project and research with a new open fault model to supplement the others. The project consists of many parts that target specific types of known open defects.","PeriodicalId":265156,"journal":{"name":"2010 IEEE International Test Conference","volume":"9 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2010-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Detecting and diagnosing open defects\",\"authors\":\"Dat Tran, L. Winemberg, D. Carder, X. Lin, Joe LeBritton, B. Swanson\",\"doi\":\"10.1109/TEST.2010.5699303\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"One of the common failures found in manufactured ICs are interconnect opens. While stuck-at and transition fault automatic test pattern generation (ATPG) patterns can detect open defects, these fault models do not catch all of them. This poster describes a project and research with a new open fault model to supplement the others. The project consists of many parts that target specific types of known open defects.\",\"PeriodicalId\":265156,\"journal\":{\"name\":\"2010 IEEE International Test Conference\",\"volume\":\"9 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2010-11-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2010 IEEE International Test Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/TEST.2010.5699303\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2010 IEEE International Test Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/TEST.2010.5699303","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
One of the common failures found in manufactured ICs are interconnect opens. While stuck-at and transition fault automatic test pattern generation (ATPG) patterns can detect open defects, these fault models do not catch all of them. This poster describes a project and research with a new open fault model to supplement the others. The project consists of many parts that target specific types of known open defects.
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