超大规模集成电路(VLSI)器件在晶圆探头和最终测试阶段的在线数据采集与分析系统

Gregory W. Papadeas, D. Gauthier
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引用次数: 5

摘要

本文介绍了一种灵活的软件系统,用于在超大规模集成电路器件的生产测试过程中在线收集参数、功能模式故障和位图数据。这些数据被自动加载到一个关系数据库中,以供后续的工艺和产量改进软件进行分析。用户可以控制在产品生命周期的每个阶段收集的数据的类型和数量。通过在每个测试中启用数据收集,同一个系统可以用于工程和调试分析。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
An on-line data collection and analysis system for VLSI devices at wafer probe and final test
This paper describes a flexible software system for the collection of parametric, functional pattern fail, and bitmap data on-line during production testing of VLSI devices. The data is automatically loaded into a relational database for subsequent analysis by process and yield improvement software. The user can control the type and amount of data that is collected at each stage of a product's life. By enabling data collection on every test, the same system can be used for engineering and debug analysis.
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