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解决低温粘接在小间距应用

2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 2017-05-01 DOI:10.23919/LTB-3D.2017.7947437
H. Oppermann, K. Lang
{"title":"解决低温粘接在小间距应用","authors":"H. Oppermann, K. Lang","doi":"10.23919/LTB-3D.2017.7947437","DOIUrl":null,"url":null,"abstract":"Fine pitch flip chip applications and small sealing ring structures are demanding for metal interconnects. Thermocompression bonding requires higher temperature. Examples are shown how to reduce bonding temperatures in different applications.","PeriodicalId":183993,"journal":{"name":"2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","volume":"57 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Tackling low temperature bonding in fine pitch applications\",\"authors\":\"H. Oppermann, K. Lang\",\"doi\":\"10.23919/LTB-3D.2017.7947437\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Fine pitch flip chip applications and small sealing ring structures are demanding for metal interconnects. Thermocompression bonding requires higher temperature. Examples are shown how to reduce bonding temperatures in different applications.\",\"PeriodicalId\":183993,\"journal\":{\"name\":\"2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)\",\"volume\":\"57 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-05-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.23919/LTB-3D.2017.7947437\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/LTB-3D.2017.7947437","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

细间距倒装芯片应用和小密封环结构对金属互连有很高的要求。热压键合需要更高的温度。举例说明了如何在不同的应用中降低键合温度。
本文章由计算机程序翻译，如有差异，请以英文原文为准。
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Tackling low temperature bonding in fine pitch applications
Fine pitch flip chip applications and small sealing ring structures are demanding for metal interconnects. Thermocompression bonding requires higher temperature. Examples are shown how to reduce bonding temperatures in different applications.
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2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)
2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)
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