CMOS技术的器件架构困境:finFET相对于平面MOSFET的机遇与挑战

B. Parvais, A. Mercha, N. Collaert, R. Rooyackers, I. Ferain, M. Jurczak, V. Subramanian, A. De Keersgieter, T. Chiarella, C. Kerner, L. Witters, S. Biesemans, T. Hoffman
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引用次数: 34

摘要

尽管finfet对短通道效应具有出色的控制,但相对于平面器件,它在混合信号域中存在不同的权衡。我们第一次报告了一个完整和全面的比较分析,表明这些权衡可以在先进的FinFET技术中得到缓解。因此,可以同时获得比平面mosfet更高的电压增益和跨导性。VT失配小于3mV。对于窄(10nm)鳍片,取µm。将演示降低对栅极螺距缩放的速度灵敏度和降低到10 ps以下的逆变器延迟。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
The device architecture dilemma for CMOS technologies: Opportunities & challenges of finFET over planar MOSFET
Despite their excellent control of short channel effects, FinFETs suffer from different trade-offs in the mixed-signal domain, with respect to planar devices. For the first time, we report a complete and comprehensive comparative analysis showing that these trade-offs can be alleviated in advanced FinFET technology. As such, higher voltage gain and transconductance than planar MOSFETs are reached at the same time. VT mismatch smaller than 3mV.µm is obtained for narrow (10nm) fins. Reduced speed sensitivity to gate pitch scaling and invertor delay reduced below 10 ps will be demonstrated.
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