M. Naeim, Hanqi Yang, Pinhong Chen, Rong Bao, Antoine Dekeyser, G. Sisto, Moritz Brunion, Rongmei Chen, G. V. D. Plas, E. Beyne, D. Milojevic
{"title":"使用细间距混合键合和tsv的3晶片堆叠3d - ic的设计实现","authors":"M. Naeim, Hanqi Yang, Pinhong Chen, Rong Bao, Antoine Dekeyser, G. Sisto, Moritz Brunion, Rongmei Chen, G. V. D. Plas, E. Beyne, D. Milojevic","doi":"10.1109/3DIC57175.2023.10155075","DOIUrl":null,"url":null,"abstract":"Multi-dies stack 3D-ICs are an extension of traditional 2-dies 3D-ICs to address the memory wall and footprint problems. This paper presents a complete Place-and-Route (PnR) flow to enable 3-dies stacked 3D-ICs from netlist partitioning to timing analysis, including original cross-dies co-optimization steps. The proposed flow is based on Integrity™ 3D-IC tool from Cadence. To demonstrate the flow, openPITON-T1 Tile design with IMEC N2 Process Design Kit (PDK) is used. The same design is implemented in normal 2D PnR flow and the proposed 3-dies stack flow. Our results show that a 3-dies stack design can achieve up to 11.4% increase in effective frequency and 50% less system footprint when compared with its 2D counterpart.","PeriodicalId":245299,"journal":{"name":"2023 IEEE International 3D Systems Integration Conference (3DIC)","volume":"32 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2023-05-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Design Enablement of 3-Dies Stacked 3D-ICs Using Fine-Pitch Hybrid-Bonding and TSVs\",\"authors\":\"M. Naeim, Hanqi Yang, Pinhong Chen, Rong Bao, Antoine Dekeyser, G. Sisto, Moritz Brunion, Rongmei Chen, G. V. D. Plas, E. Beyne, D. Milojevic\",\"doi\":\"10.1109/3DIC57175.2023.10155075\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Multi-dies stack 3D-ICs are an extension of traditional 2-dies 3D-ICs to address the memory wall and footprint problems. This paper presents a complete Place-and-Route (PnR) flow to enable 3-dies stacked 3D-ICs from netlist partitioning to timing analysis, including original cross-dies co-optimization steps. The proposed flow is based on Integrity™ 3D-IC tool from Cadence. To demonstrate the flow, openPITON-T1 Tile design with IMEC N2 Process Design Kit (PDK) is used. The same design is implemented in normal 2D PnR flow and the proposed 3-dies stack flow. Our results show that a 3-dies stack design can achieve up to 11.4% increase in effective frequency and 50% less system footprint when compared with its 2D counterpart.\",\"PeriodicalId\":245299,\"journal\":{\"name\":\"2023 IEEE International 3D Systems Integration Conference (3DIC)\",\"volume\":\"32 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2023-05-10\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2023 IEEE International 3D Systems Integration Conference (3DIC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/3DIC57175.2023.10155075\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2023 IEEE International 3D Systems Integration Conference (3DIC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/3DIC57175.2023.10155075","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Design Enablement of 3-Dies Stacked 3D-ICs Using Fine-Pitch Hybrid-Bonding and TSVs
Multi-dies stack 3D-ICs are an extension of traditional 2-dies 3D-ICs to address the memory wall and footprint problems. This paper presents a complete Place-and-Route (PnR) flow to enable 3-dies stacked 3D-ICs from netlist partitioning to timing analysis, including original cross-dies co-optimization steps. The proposed flow is based on Integrity™ 3D-IC tool from Cadence. To demonstrate the flow, openPITON-T1 Tile design with IMEC N2 Process Design Kit (PDK) is used. The same design is implemented in normal 2D PnR flow and the proposed 3-dies stack flow. Our results show that a 3-dies stack design can achieve up to 11.4% increase in effective frequency and 50% less system footprint when compared with its 2D counterpart.