2023 IEEE International 3D Systems Integration Conference (3DIC)

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2023 IEEE International 3D Systems Integration Conference (3DIC) - 最新文献

Design Enablement of 3-Dies Stacked 3D-ICs Using Fine-Pitch Hybrid-Bonding and TSVs

Pub Date : 2023-05-10 DOI: 10.1109/3DIC57175.2023.10155075 M. Naeim, Hanqi Yang, Pinhong Chen, Rong Bao, Antoine Dekeyser, G. Sisto, Moritz Brunion, Rongmei Chen, G. V. D. Plas, E. Beyne, D. Milojevic

A Study on a Tether-Less Approach Towards Micro-Transfer-Printing of Large-Footprint Power Micro-Inductor Chiplets

Pub Date : 2023-05-10 DOI: 10.1109/3DIC57175.2023.10155034 Somnath Pal, Liang Ye, J. O'Callaghan, F. Atar, C. O'Mathúna, B. Corbett, R. Sai, Sambuddha Khan

Impact of Super-long-throw PVD on TSV Metallization and Die-to-Wafer 3D Integration Based on Via-last

Pub Date : 2023-05-10 DOI: 10.1109/3DIC57175.2023.10154930 Jiaying Shen, Chang Liu, Tadaaki Hoshi, Atsushi Sinoda, H. Kino, Tetsu Tanaka, M. Mariappan, M. Koyanagi, T. Fukushima

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