R. Mendaros, Arnulfo Evangelista, Jerome Paghasian
{"title":"失效缺陷建模——有效的失效分析仿真工具","authors":"R. Mendaros, Arnulfo Evangelista, Jerome Paghasian","doi":"10.1109/IPFA.2016.7564286","DOIUrl":null,"url":null,"abstract":"Failure defect modeling (FDM), a software simulation technique, replicates the failure mode and characteristic of a defective integrated circuit thus narrows down the analysis area. The results of FDM guides the analyst in the selection of the suitable physical failure analysis technique and process steps to successfully uncover the defect.","PeriodicalId":206237,"journal":{"name":"2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","volume":"22 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-07-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Failure defect modeling — An effective failure analysis simulation tool\",\"authors\":\"R. Mendaros, Arnulfo Evangelista, Jerome Paghasian\",\"doi\":\"10.1109/IPFA.2016.7564286\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Failure defect modeling (FDM), a software simulation technique, replicates the failure mode and characteristic of a defective integrated circuit thus narrows down the analysis area. The results of FDM guides the analyst in the selection of the suitable physical failure analysis technique and process steps to successfully uncover the defect.\",\"PeriodicalId\":206237,\"journal\":{\"name\":\"2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"volume\":\"22 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-07-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IPFA.2016.7564286\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2016.7564286","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Failure defect modeling — An effective failure analysis simulation tool
Failure defect modeling (FDM), a software simulation technique, replicates the failure mode and characteristic of a defective integrated circuit thus narrows down the analysis area. The results of FDM guides the analyst in the selection of the suitable physical failure analysis technique and process steps to successfully uncover the defect.