在厚度为1.3 nm的MOSFET中提取Si-SiO2界面阱密度

D. Bauza
{"title":"在厚度为1.3 nm的MOSFET中提取Si-SiO2界面阱密度","authors":"D. Bauza","doi":"10.1109/ESSDERC.2002.194912","DOIUrl":null,"url":null,"abstract":"It is shown that reliable interface trap density values can be extracted from MOS devices with ultrathin oxides by using charge pumping and small gate voltage swings. This presents three advantages with respect to the conventional large gate voltage swing approach: the extraction is simple as carrier emission do not contribute to the CP signal so that the CP current magnitude directly reflects the interface trap density; the tunneling current is strongly reduced allowing a more easy extraction of the CP signal; this prevents the insulator and the insulator-silicon interface from any degradation. By doing so, interface trap densities from MOS devices with oxides down to 1.3 nm thick are reported for the first time.","PeriodicalId":207896,"journal":{"name":"32nd European Solid-State Device Research Conference","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2002-09-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"Extraction of Si-SiO2 Interface Trap Densities in MOSFET's with Oxides Down to 1.3 nm Thick\",\"authors\":\"D. Bauza\",\"doi\":\"10.1109/ESSDERC.2002.194912\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"It is shown that reliable interface trap density values can be extracted from MOS devices with ultrathin oxides by using charge pumping and small gate voltage swings. This presents three advantages with respect to the conventional large gate voltage swing approach: the extraction is simple as carrier emission do not contribute to the CP signal so that the CP current magnitude directly reflects the interface trap density; the tunneling current is strongly reduced allowing a more easy extraction of the CP signal; this prevents the insulator and the insulator-silicon interface from any degradation. By doing so, interface trap densities from MOS devices with oxides down to 1.3 nm thick are reported for the first time.\",\"PeriodicalId\":207896,\"journal\":{\"name\":\"32nd European Solid-State Device Research Conference\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2002-09-24\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"32nd European Solid-State Device Research Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ESSDERC.2002.194912\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"32nd European Solid-State Device Research Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESSDERC.2002.194912","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 5

摘要

结果表明,利用电荷泵送和栅极电压的小波动,可以从超薄氧化物MOS器件中提取出可靠的界面阱密度值。与传统的大栅极电压摆幅方法相比,这有三个优点:载波发射不影响CP信号,提取简单,因此CP电流大小直接反映了界面陷阱密度;隧道电流大大减小,使CP信号更容易提取;这可以防止绝缘体和绝缘体-硅界面的任何退化。通过这样做,首次报道了具有1.3 nm厚的氧化物的MOS器件的界面陷阱密度。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Extraction of Si-SiO2 Interface Trap Densities in MOSFET's with Oxides Down to 1.3 nm Thick
It is shown that reliable interface trap density values can be extracted from MOS devices with ultrathin oxides by using charge pumping and small gate voltage swings. This presents three advantages with respect to the conventional large gate voltage swing approach: the extraction is simple as carrier emission do not contribute to the CP signal so that the CP current magnitude directly reflects the interface trap density; the tunneling current is strongly reduced allowing a more easy extraction of the CP signal; this prevents the insulator and the insulator-silicon interface from any degradation. By doing so, interface trap densities from MOS devices with oxides down to 1.3 nm thick are reported for the first time.
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