有机电路板上的三维光学互连

T. Matsubara, Keiko Oda, Kei-ichiro Watanabe, Kaori Tanaka, Maraki Maetani, Yuriko Nishimura, Shigeo Tanahashi
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引用次数: 14

摘要

我们提出了高速光互连,这是一种三维光通道,使用金属线和衬垫在有机电路板上制造的聚合物材料。这些光通道不仅在平面上传输光信号,而且将光信号传输到电路板的另一侧。它有以下三个部分;(1)弯曲平行光波导;(2) 45度反射镜;(3)光学通孔。在有机电路板CPCoretrade上新开发了带有电流线路和焊盘的四通道三维光通道。我们用传输损耗和通过眼图来表征光通道,并确定了光信号的传输。然后,采用850nm VCSEL倒装在电路板上,以有源和无源电子器件和元件作为驱动电路,演示了高达3Gbps/信道的光信号传输
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Three dimensional optical interconnect on organic circuit board
We propose high speed optical interconnection which is three dimensional optical lanes using polymer materials fabricated on an organic circuit board with metal lines and pads. These optical lanes transmit optical signals not only on a plane surface but into the other side of a circuit board. It has following three particular portions; (1) curved parallel optical waveguide; (2) 45 degree reflection mirror; (3) optical via hole. Four channel three dimensional optical lanes with current electrical lines and pads are newly developed on the organic circuit board named CPCoretrade. We characterize the optical lanes by transmission loss and passed through eye diagram, and optical signal transmission is confirmed. Then optical signal transmission up to 3Gbps/channel are demonstrated with 850nm VCSEL flip-attached on the circuit board with active and passive electronic devices and components as driving circuit
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